2018-06-22 - Imec

Imec Presents CFET

Touted as scaling contender for nodes beyond N3

2017-09-14 - Rick Merritt, EE Times

TSMC Updates its Silicon Menu

TSMC added process and packaging variants to its broad foundry portfolio, but one analyst said some updated results were below…

2017-08-04 - Vanderbilt University

Monolayer process enables dual-function devices

The triangular pattern formed by the 2D material chalcogenide can help create multifunctional devices.

2017-07-18 - Brian Dipert

Note 7 recall: Samsung’s expensive, enduring lesson

Going forward, Samsung is instituting an eight-point plan in the hopes of avoiding more multi-billion dollar recall and programme cancellation…

2017-07-18 - Ariella Brown

Bosch looks at broader picture with $1.1B chip plant

It’s true the company is invested in the development of autonomous cars, but the story that Bosch itself tells about…

2017-07-11 - Gartner

AI, VPAs fail to drive demand for handsets, PCs

Global shipments of PCs, tablets and smartphones will exceed 2.3 billion units in 2017, a 0.3% drop from 2016, according…

2017-07-10 - Cirrus Logic

Voice capture kit improves interactions with Alexa

Cirrus Logic’s echo cancellation technology allows the user to interrupt loud music playback and Alexa responses, so Alexa can respond…

2017-07-10 - EDN Asia

Vietnam dangles incentives to South Korean investors

South Korea has been Vietnam's top foreign investor since 2014, with 70% of its investments going into manufacturing and processing.

2017-07-04 - Jim O'Reilly

Who will win in Toshiba’s complex flash unit sale?

Buying Toshiba's memory unit is a complex issue, especially since the company makes for an attractive target as positioning for…

2017-06-27 - Rick Merritt

China drives growth in hardware start-ups

After outpacing the U.S. in the size of early venture rounds for hardware start-ups, China is set to surpass Japan…