2022-01-12 - ACN Newswire

Tanaka Denshi Kogyo to Establish New Plant in China

Tanaka Denshi Kogyo will establish a new plant in Hangzhou, China, for the production of aluminum bonding wires for power…

2021-12-08 - Dai Nippon Printing Co. Ltd

DNP develops interposer for next-gen semiconductor packaging

DNP has developed an interposer, a high-performance intermediate device that is expected to play a key role in next-generation semiconductor…

2021-07-15 - Kedar Patankar

Common packaging and PCB issues for SoCs

This article looks at packaging and PCB issues that impinge on the success of SoC development.

2021-07-08 - Kedar Patankar

Chip design converges with packaging and PCB in SoC era

SoC developers must become system developers to properly integrate analog and digital IP in silicon and handle extraordinary complexity and…

2021-05-24 - Jeff Hockert

Optical interconnects can meet data center challenges

Data center networks can be revolutionized with optical I/O directly designed in server chips and packages.

2021-03-11 - Majeed Ahmad

SiP module targets tracking devices for IoT applications

Miniaturization, localization, and security define the SiP module targeted at tracking devices for IoT applications.

2021-02-19 - Wendy Luiten and John Parry

Using digital design to implement physical reliability

Digital design is increasingly used earlier in the design cycle to predict the zero-hour nominal performance and to access reliability.

2020-10-20 - Majeed Ahmad

10 basic terms for advanced IC packaging

Here is a brief synopsis of the 10 most common terms used in advanced IC packaging technologies.

2020-10-12 - Richard Quinnell

Advanced packaging could help solve chip I/O limitations

Advanced techniques such as FOWLP allow increased component density as well as boost performance and help solve chip I/O limitations.