2022-01-10 - Infineon Technologies AG

Infineon enhances performance of GaN SG HEMTs

The EiceDRIVER 1EDN71x6G HS 200V single-channel gate driver ICs family enhances the performance of CoolGaN Schottky Gate HEMTs.

2021-12-21 - Renesas Electronics Corp.

Renesas smart gate driver integrates analog power components

The RAA227063 pairs with a variety of MCUs to deliver efficient, flexible motor control in a smaller footprint.

2021-12-02 - Renesas Electronics Corp.

Renesas launches new PLC modem IC

Evaluation kits and tools for AC and DC power lines let developers to immediately evaluate applications supporting high-speed communication at…

2021-11-18 - Stephen Las Marias

TI wins four awards at EE Awards Asia and accelerates the momentum of GaN technology

Texas Instruments has won four awards at this year’s EE Awards Asia for its LMG3525R030-Q1 gallium nitride (GaN) device.

2021-11-11 - Efficient Power Conversion Corp. (EPC)

EPC eGaN FETs enhance drive performance of low-cost motors

The EPC9145 GaN-based inverter enhances the performance of the motor for range, precision, torque, and eliminates the electrolytic capacitors for…

2021-10-28 - Efficient Power Conversion Corp. (EPC)

EPC expands transistor lineup with 40V eGaN FET

EPC's EPC2067 eGaN FET offers designers a smaller, more efficient, and more reliable device for high-performance, space-constrained applications.

2021-10-21 - Infineon Technologies AG

Infineon technology powers Sungrow’s PV string inverter solution

Sungrow's inverter integrates Infineon's customized EasyPACK power modules equipped with the newly released CoolSiC MOSFETs.

2021-10-15 - Microchip Technology Inc.

Microchip Vref IC provides low drift for extended-temperature automotive applications

The new device completes Microchip's family of Vref products providing increased reliability and AEC-Q100 qualification.

2021-08-19 - Renesas Electronics Corp.

Renesas PMIC delivers complete power solution to reduce design time

Renesas' RAA215300 PMIC complements the RZ/V2L and RZ/G2L MPUs designed for AI-enabled applications.

2021-07-20 - ACN Newswire

Tanaka develops brazing filler metal/copper composite material for power devices

Tanaka has developed an active brazing filler metal/copper composite material that can be used as next-generation heat sinks for power…