Deep silicon etch technology enables next-gen power devices
Lam Research's Syndion GP allows chipmakers to develop next-gen power devices and power management ICs using deep silicon etch technology.
Infineon launches complete power management solutions for next-gen Intel Xeon processors
Infineon has launched a complete power management offering for compute servers based on Intel's Sapphire Rapids CPUs.
Five trends shaping the future of power management designs
Improvements in power density, EMI, isolation, quiescent current, and noise are giving designers the capabilities to push power further.
Analog Devices’ wBMS achieves ISO/SAE 21434 certification
ADI's wBMS is now certified to the highest standard of automotive cybersecurity engineering and management.
Microchip enables Qi 1.3 wireless charging with authentication
Microchip's new industrial grade TrustFLEX ECC608 and the automotive grade Trust Anchor TA100 are designed for Qi 1.3 power transmitters.
Vicor demos highest power density solutions for xEVs at WCX 2022
Vicor will unveil three new approaches for powering xEVs at the upcoming World Congress Experience (WCX) in Detroit.
Analog Devices and Gridspertise collaborating to strengthen smart grids worldwide
Analog Devices and Gridspertise are collaborating to advance the resiliency and quality of smart grids around the world.
How to implement a PWM fan driver using configurable chips
Here is how to configure a power management IC to implement a PWM fan driver with temperature proportional speed control…
Analog Devices’ Baoxing Chen named IEEE Fellow
Analog Devices' Technology Fellow Dr. Baoxing Chen has been named a 2022 IEEE Fellow for his contributions to integrated signal-power…
Taking a step back: Basic thermal concepts
Even if you understand the basics of thermodynamics, a new book provides added insight and perspective.