Next-gen space-grade semiconductors will consume almost 100W, but with junction temperatures remaining the same, removing this heat is paramount for…
Smiths Interconnect’s Joule 20 test socket provides first-class electrical and mechanical performance in testing peripheral ICs.
Smiths Interconnect's Galileo test socket is an innovative, low-profile test socket engineered to support today's high-performance digital and RF applications.
A new breed of highly-integrated devices addresses the deficiency of external level shifter circuits to offer a negative output DC-DC…
A modular 100V power-distribution solution offers benefits to supply the latest ultra-deep-submicron space-grade semiconductors.
The design of CMOS image sensors is going through an accelerated phase of development to serve a variety of applications.
NXP combines the security subsystem on its iMX processors with Microsoft’s Azure Sphere edge-to-cloud security service.
Roller-based techniques and tools can now fabricate active electronic components as well as their interconnection.
Creating and decomposing a DRC-compliant design for self-aligned multi-patterning processes is not a trivial matter.
The Korean memory chipmaker highlights the evolutionary path for DRAM and NAND flash technologies in a keynote address to IEEE…