2021-10-21 - Rajan Bedi

Keeping space chips cool and reliable

Next-gen space-grade semiconductors will consume almost 100W, but with junction temperatures remaining the same, removing this heat is paramount for…

2021-09-20 - Smiths Interconnect

Joule 20 test socket ensures increased throughput and reliability in peripheral IC test

Smiths Interconnect’s Joule 20 test socket provides first-class electrical and mechanical performance in testing peripheral ICs.

2021-09-17 - Smiths Interconnect

Smiths Interconnect test socket enables rapid device bring up, characterization

Smiths Interconnect's Galileo test socket is an innovative, low-profile test socket engineered to support today's high-performance digital and RF applications.

2021-06-10 - Anthony T. Huynh

A compact, easy-to-use negative output DC-DC solution

A new breed of highly-integrated devices addresses the deficiency of external level shifter circuits to offer a negative output DC-DC…

2021-06-02 - Rajan Bedi

Power-distribution solution meets needs of NewSpace applications

A modular 100V power-distribution solution offers benefits to supply the latest ultra-deep-submicron space-grade semiconductors.

2021-05-31 - Kangbong Seo

Development of CMOS image sensors accelerates to serve a variety of applications

The design of CMOS image sensors is going through an accelerated phase of development to serve a variety of applications.

2021-04-19 - Majeed Ahmad

Providing end-to-end security solutions from the edge to the cloud

NXP combines the security subsystem on its iMX processors with Microsoft’s Azure Sphere edge-to-cloud security service.

2021-04-19 - Richard Quinnell

Print active electronic components and their interconnection

Roller-based techniques and tools can now fabricate active electronic components as well as their interconnection.

2021-04-15 - Jae Uk Lee, Ryoung Han Kim, IMEC, and David Abercrombie, Rehab Kotb Ali, Siemens EDA

Creating and decomposing a DRC-compliant design for SAMP processes

Creating and decomposing a DRC-compliant design for self-aligned multi-patterning processes is not a trivial matter.

2021-04-14 - Majeed Ahmad

The evolutionary path for DRAM and NAND flash technologies

The Korean memory chipmaker highlights the evolutionary path for DRAM and NAND flash technologies in a keynote address to IEEE…