The 3-nm fab race: Samsung reportedly nears the finish line
Samsung has been reported to start chip manufacturing at 3nm process node while TSMC is planning 3nm chip manufacturing by…
Renesas launches I3C intelligent switch family
Renesas has unveiled the industry’s first I3C intelligent switch devices targeting next generation server motherboards and other infrastructure equipment.
Why Broadcom is acquiring VMware
Is Broadcom acquiring a cash cow or building a vertical stack of components from processor to application? The latter could…
Broadcom to strengthen cloud software capabilities in bid for VMware
At the outset, it seems another attempt to align chipmaker Broadcom to the software side of the rapidly growing data…
TSMC targets conversion to 1.4-nm process node in June
TSMC plans to convert its 3-nm process R&D into a 1.4-nm process in June and thus reclaim sub-2-nm leadership from…
SIMMTECH opens first advanced manufacturing facility in Southeast Asia
SUSTIO's factory in Penang will increase SIMMTECH's total capacity for semiconductor packaging substrate and PCB by 20 percent.
Chip fab industry makeover
There will be an 8.7% jump in IC industry capacity forecast this year, and it comes primarily from the addition…
A look at the impact of Intel’s foundry foray on EDA, IP industries
Like IC design, the EDA and IP industries are an intrinsic part of the IC manufacturing ecosystem spearheaded by semiconductor…
The software-defined vehicle needs hardware that goes the distance
How do we deliver a hardware platform that has the compute capability, flexibility and capacity to handle complex use cases…
Disrupt or be disrupted: Intel and the great semiconductor fab game
Find out where Intel stands in its bid to compete with fab business behemoths TSMC and Samsung.