Keeping space chips cool and reliable
Next-gen space-grade semiconductors will consume almost 100W, but with junction temperatures remaining the same, removing this heat is paramount for…
Joule 20 test socket ensures increased throughput and reliability in peripheral IC test
Smiths Interconnect’s Joule 20 test socket provides first-class electrical and mechanical performance in testing peripheral ICs.
Smiths Interconnect test socket enables rapid device bring up, characterization
Smiths Interconnect's Galileo test socket is an innovative, low-profile test socket engineered to support today's high-performance digital and RF applications.
A compact, easy-to-use negative output DC-DC solution
A new breed of highly-integrated devices addresses the deficiency of external level shifter circuits to offer a negative output DC-DC…
Power-distribution solution meets needs of NewSpace applications
A modular 100V power-distribution solution offers benefits to supply the latest ultra-deep-submicron space-grade semiconductors.
Development of CMOS image sensors accelerates to serve a variety of applications
The design of CMOS image sensors is going through an accelerated phase of development to serve a variety of applications.
Providing end-to-end security solutions from the edge to the cloud
NXP combines the security subsystem on its iMX processors with Microsoft’s Azure Sphere edge-to-cloud security service.
Print active electronic components and their interconnection
Roller-based techniques and tools can now fabricate active electronic components as well as their interconnection.
Creating and decomposing a DRC-compliant design for SAMP processes
Creating and decomposing a DRC-compliant design for self-aligned multi-patterning processes is not a trivial matter.
The evolutionary path for DRAM and NAND flash technologies
The Korean memory chipmaker highlights the evolutionary path for DRAM and NAND flash technologies in a keynote address to IEEE…