A modular 100V power-distribution solution offers benefits to supply the latest ultra-deep-submicron space-grade semiconductors.
The design of CMOS image sensors is going through an accelerated phase of development to serve a variety of applications.
NXP combines the security subsystem on its iMX processors with Microsoft’s Azure Sphere edge-to-cloud security service.
Roller-based techniques and tools can now fabricate active electronic components as well as their interconnection.
Creating and decomposing a DRC-compliant design for self-aligned multi-patterning processes is not a trivial matter.
The Korean memory chipmaker highlights the evolutionary path for DRAM and NAND flash technologies in a keynote address to IEEE…
Functions in an SoC communicating with each other through an interconnect architecture is not so different from a network.
There is a worldwide interest in 2D materials, especially their promise to further extend the logic chip technology roadmap.
The open-source software journey provides lessons for technology endeavors such as RISC-V to proliferate like Linux software.