2023-05-26 - Majeed Ahmad

Why embedded chipmakers are acquiring ML software firms

Embedded processor suppliers are increasingly offering complementary software tools alongside chips to address AI/ML learning needs.

2023-05-23 - Stephen Las Maria

PowerUP Asia 2023 opens tomorrow

PowerUP Asia highlights the latest technology developments, challenges, and opportunities in the power electronics sector.

2023-05-16 - STMicroelectronics

2023 STM32 Summit and Fans Carnival returns to Shenzhen

The STM32 Summit, now in its sixth year, is the premier technology showcase of STMicroelectronics' STM32 products and solutions.

2023-05-15 - Stephen Las Marias

IDM approach continues to strengthen ST’s semiconductor leadership

ST's Catania facility expansion is a key step in advancing the company's vertical integration strategy for its SiC business.

2023-05-12 - STMicroelectronics

STMicroelectronics toolchain and software package ease development of edge processing with ISPUs

STMicroelectronics has released a toolchain and accompanying software package for programming the ISPU embedded in the latest-generation intelligent MEMS IMUs.

2023-04-28 - EDN Asia

Industry experts to discuss GaN and SiC technologies at PowerUP Asia

A panel of industry experts will discuss the challenges that engineers currently face in a variety of application contexts for…

2023-04-27 - STMicroelectronics

STMicroelectronics publishes 2023 Sustainability Report

STMicroelectronics has released its annual sustainability report detailing 2022 performance, strategy, and ongoing action plans.

2023-04-24 - Stephen Las Marias

GaN and SiC technologies on spotlight at PowerUP Asia conference

WBG is one of the key focus topics at the upcoming PowerUP Asia conference and virtual exhibition on May 24-26,…

2023-04-24 - STMicroelectronics

STMicroelectronics automotive inertial module certified to ASIL B

ST's ASM330LHB automotive-qualified MEMS inertial-sensing module provides accurate measurements for a wide variety of vehicle functions.

2023-04-21 - STMicroelectronics

ZF and STMicroelectronics ink multi-year supply agreement for SiC devices

ST will supply SiC devices to be integrated in ZF's new modular inverter architecture going into series production in 2025.