Test wiring harnesses and control equipment with audible ohmmeter design
This circuit allows for "heads up" testing of wiring harnesses and control equipment, and various components.
2D materials promise to extend the logic chip technology roadmap
There is a worldwide interest in 2D materials, especially their promise to further extend the logic chip technology roadmap.
Selecting passives for space-grade switching regulators
Engineers are increasingly having to design-in switching regulators and choosing passives is very important as they determine the quality of…
Design protects transistors and load from large through current
This amplifier circuit protects the output transistors and the load from a large uncontrollable through current.
MasterGaN Power SiPs Integrated with Asymmetrical GaN Transistors
STMicroelectronics’ MasterGaN2 is the first to contain two asymmetric GaN transistors, delivering an integrated GaN solution suited to soft-switching and…
Advanced packaging could help solve chip I/O limitations
Advanced techniques such as FOWLP allow increased component density as well as boost performance and help solve chip I/O limitations.
Measure dielectric absorption to estimate a capacitor’s quality
Estimate a capacitor's quality or recognize its type of dielectric by measuring its dielectric absorption.
Applying innovative FanFET technology to 3D-NAND Flash
This article introduces the innovative Fan type Field Effect Transistor (FanFET) technology applied to 3D-NAND Flash flash memory and a…
GaN FETs can simplify application designs
GaN HEMT H2 FETs from Nexperia come in TO-247 and CCPAK surface-mount packages for use in automotive, 5G, and data-center…
1700-V SMD SiC MOSFETs offer greater reliability
Infineon now offers a 1700-V class in its CoolSiC MOSFET family, enabling greater reliability, as well as low switching and…