Cadence's new design flows support the TSMC 3Dblox standard for 3D front-end design partitioning in complex systems.
The trio of large EDA houses are onboard and here is a synopsis of their undertakings to prepare for the…
Taiwan's mega-fab will add two variants to its N2 technology in 2026: N2P with backside power delivery and N2X for…
The mega-fab's 2023 North America Technology Symposium has provided ample information on the latest 3-nm nodes: N3P, N3X and N3AE.
Cadence has collaborated with TSMC to optimize its Virtuoso platform for the 79GHz mmWave design reference flow on TSMC's N16…
Arm is building prototype chips to demonstrate the power and capabilities of its IPs and designs to the wider market.
The close collaboration addresses chip, package and system-level effects for designs on TSMC advanced technologies.
Taiwan's mega-fab has successfully launched 3-nm process node and its yield is reportedly around 80% for early chips produced for…
TSMC is setting up a new 1-nm chip production facility that will be located in an industrial park in Longtan…
TSMC has certified Cadence's digital and custom/analog design flows for the latest N4P and N3E processes.