TSMC builds up R&D capacity for 3nm

Article By : Julien Happich

TSMC is staffing up its R&D effort in significant numbers to develop 5nm and 3nm process technologies.

Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) is planning to actively develop the 5nm process technology, while dedicating anywhere between 300 and 400 R&D personnel in developing a 3nm process, which it intends to ultimately push down further to 1nm, according to a local publication, CTimes.

In an interview, Dr. Mark Liu, President and Co-CEO of TSMC, said that the company will use its 3D stacked architecture to break the limitation of Moore's law and move toward the 3nm manufacturing node.

Liu stressed that TSMC has established the complete ecosystems with the intellectual property, automation solutions and equipment providers, and will continue to invest in technology development and research, and to make Taiwan become the strongest fortress in the global semiconductor industry.

He also said that the role of Taiwan's semiconductor industry became more and more important in the global semiconductor market with a share of 21%, where its output ranks first place in the foundry, IC packaging and testing business, and IC design ranks the world's second and the Fourth in memory production.

This article was first published on EE Times Europe.

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