Joule 20 Test Socket Solution for QFN Package Testing
Smiths Interconnect
With the rapid growth in QFN packaging solutions, IC Test Engineering teams need innovative test socket solutions in order to meet the performance and time-to-market demands for their products. Package test set-ups to support advanced RF, Analog, Power Management, and High-Speed Digital IC’s require excellent signal integrity, reliable and repeatable contact resistance, and long production lifetimes. Meeting these challenges, Smiths Interconnect is proud to introduce Joule-20.
In this webinar, we will outline how Joule-20 can provide a drop-in replacement that can be used with existing PCB footprints, bringing you increased ROI in both Engineering / Characterization applications as well as High Volume Manufacturing. More further, we will step you through Joule-20’s architecture in detail, and show how you can reduce Load Board PCB pad damage, save time, and lower costs by partnering with a global leader in semiconductor test sockets.
Presenter
Noel Villanueva-Business Development Manager
Noel Villanueva is a Business Development Manager for Semiconductor Test at Smiths Interconnect, Philippines. He previously held process, product, equipment development and customer service managerial positions at IDM and OSAT companies in Asia. He has been with Smiths for 9 years managing sales and field applications engineering for Semi Test products in Philippines. He holds a Bachelor of Science in Mechanical Engineering from Far Eastern University.
Lucky Draw
Disinfect Bag
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About Smiths Interconnect
Smiths Interconnect is a leading provider of innovative solutions for critical semiconductor test applications. Smiths Interconnect’s test sockets and probe card solutions offer superior quality and reliability, providing customers with a competitive advantage. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms for area array, peripheral, wafer level and Package on Package (PoP) devices as well as high performance spring probe technology and cable assemblies. Our extensive product portfolio accommodates devices with finest micro pitches as well as those with very high bandwidth requirements. Off-the -shelf and custom products are proven to deliver the best solution for the customer’s specific needs.
To learn more, please visit: www.smithsinterconnect.com
Tel: +65 6846 1655
Email: info.asia@smithsinterconnect.com